Design, Optimization and Evaluation of Copper Nanoparticle-loaded Hydrogel for Drug Delivery and Wound Healing Applications

Authors

  • Shiv Sharan Pal*, Vishal Dubey, Karuna Author

Keywords:

Nanoparticles, Hydrogel, Antimicrobial

Abstract

This study presents the design, optimization, and evaluation of a novel copper nanoparticle-loaded hydrogel aimed at enhancing drug delivery and wound healing applications.  Copper nanoparticles (CuNPs) are recognized for their potent antimicrobial, anti-inflammatory, and angiogenic properties, making them ideal candidates for accelerating wound healing processes and improving drug delivery efficiency.  The hydrogel matrix, composed of biocompatible and biodegradable polymers, acts as a controlled release system, ensuring sustained delivery of copper nanoparticles and therapeutic agents to the wound site.

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Published

2025-05-30

Issue

Section

Articles

How to Cite

Design, Optimization and Evaluation of Copper Nanoparticle-loaded Hydrogel for Drug Delivery and Wound Healing Applications. (2025). International Journal of Pharmacy and Life Sciences, 16(5), 22-30. http://ijplsjournal.com/index.php/ijpls/article/view/283

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